SCCG temperature measurement NTC thermistor chip
The thickness of the SCCG series glass-encapsulated chips ranges from 0.18 mm to 0.25 mm, and the size ranges from 0.45 mm to 0.55 mm. They are mainly used to make glass-encapsulated thermistors (heat-sensitive elements) and other thermal sensitive components that require fast response. Ground resistance.
- Commodity name: SCCG temperature measurement NTC thermistor chip
- 产品描述
- 产品规格及参数
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NTC (negative temperature coefficient) thermistor is a heat-sensitive semiconductor resistor. Its resistance value decreases as the temperature increases. The temperature coefficient of resistance is in the range of -2%/k~-6%/k, which is about that of metal. 10 times the temperature coefficient of resistance. Changes in the resistance value of the NTC thermistor can be caused by changes in the external ambient temperature, or can be caused by self-heating due to the flow of current. His various uses are based on this property. NTC thermistors are constructed from polycrystalline ceramics with mixed oxides. The conductive mechanism of this material is quite complex.
Huaju Electronics is an early professional manufacturer of NTC thermistors in China. The NTC thermistors produced by the company are widely used in various handheld devices and miniaturized electronic equipment, and are also widely used in various temperature measurement and temperature compensation occasions. The NTC thermistors produced by the company are low in price and of high quality, and can completely replace foreign brands such as Murata, TDK, and EPCOS.
SCCG glass-sealed chips are mainly used to make glass-sealed (axial lead, single-ended lead) thermistor chips, and are also often used to make special thermistors for temperature thermometers. The chip is the core component of the thermistor (heat-sensitive element). The accuracy, reliability, consistency, and long-term stability of the thermistor mainly depend on the quality and performance of the chip.
1. Product introduction:
The thickness of the SCCG series glass-encapsulated chips ranges from 0.18 mm to 0.25 mm, and the size ranges from 0.45 mm to 0.55 mm. They are mainly used to make glass-encapsulated thermistors (heat-sensitive elements) and other thermal sensitive components that require fast response. Ground resistance. SCCG series glass-sealed thermistor chips are produced using the most mature chemical co-precipitation process. Powder preparation, high-temperature sintering, slicing, electrode preparation, analysis and testing are all produced using domestic leading high-performance equipment and company-made special equipment. The process is controllable and traceable. All raw and auxiliary materials and electrode silver paste are made of high-purity environmentally friendly materials. They are purchased from well-known manufacturers at home and abroad. The channels are stable and the quality is controllable. 3. Model name, appearance structure and dimensions:
Basic information of SCCG series glass sealed chips
product name
SCCG series glass sealed thermistor chip Series code
SCCG model rules
SCCG - resistance value - B value - resistance accuracy Model example
SCCG - 50K - 3950 - 1% Example explanation
SCCG series glass-sealed chips, B value (25/50): 3950, resistance value at 25°C: 50K, resistance accuracy: ±1% Chip size and main performance
Chip thickness (H): between 0.18mm-0.25mm. Chip side length (L1): 0.45mm to 0.55mm, generally L1=L2 Chip side length (L2): 0.45mm to 0.55mm, generally L2=L1 Electrode composition: lead-free silver paste, containing not less than 75% silver. Operating temperature range: -60℃ to +200℃ Time constant: less than 1 second B value range: 3000-4600 B value accuracy: less than ± 1% B (25/50) Resistance range: 1K - 500K Resistance accuracy (25 degrees): ±1%, ±2%, ±3% 1% accuracy delivery standard
Greater than 60% within ±1%, greater than 80% within ±2% 2% accuracy delivery standard
Greater than 60% within ±2%, greater than 80% within ±3% 3% accuracy delivery standard
Greater than 60% within ±3%, greater than 90% within ±5% Ordering Guide
The commonly used lead process for SCCG series glass-encapsulated chips is: packaging in a controlled atmosphere. , both single-ended leads and axial leads are available. The glass bulb (glass glaze) and leads selected by the user should meet the expansion coefficient required by the glass sealing process). Users should specify the allowed size range of the chip when ordering. If the user has special requirements for the chip, he should explain them. Display of some styles of components that can be produced using SCCG chips
Key words:
SCCG temperature measurement NTC thermistor chip
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